Integration of Top-Down and Bottom-Up Processes: Prospect for the processes required in the production of next-generation MEMS

摘要

Wide dynamic range of processing, both of high resolution in sub-nanometer level and large scale processing over meter level, are required in the production of next-generation MEMS devices. However, traditional top-down processes like lithography have limitation in resolution and throughput. On the other hand, bottom-up processes or self-organizing processes like self-assembly of fine particles have potential to break through the limitation of the resolution though it has some drawbacks. This paper introduces a concept of integration of top-down and bottom-up processes including the modification processes to apply appropriate driving force to the bottom-up processes.