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Performance of 4H-SiC and Wz-GaN Over InP IMPATT Devices at 1.0 THz Frequency

机译:在1.0 ZHz频率下,在INP Impatt设备上的4H-SIC和WZ-Ga的性能

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We have studied the performance of impact avalanche transit time (IMPATT) devices based on wide band gap semiconductor materials like 4H-SiC and Wz-GaN over low band gap InP at 1.0 tera-hertz (THz) frequencies. A drift-diffusion model is used to design double drift region (DDR) IMPATTs based on these materials. From the results, it is found that the RF power for 4H-SiC gives 26 times more than InP and 4 times than Wz-GaN based IMPATT diode. Similarly, the Wz-GaN has more noise of about 32.6 dB as compared to 4H-SiC (29.5 dB) and InP (31.5 dB). Generation of significant RF power for 4H-SiC with moderate noise is better as compared to the InP and Wz-GaN based devices. The excellent results indicate that 4H-SiC based IMPATT diodes are the future terahertz sources.
机译:我们已经研究了基于宽带隙半导体材料的影响雪崩传输时间(IMPATT)器件在1.0TERE-HERTZ(THz)频率下的低频带隙INP等宽带隙半导体材料。漂移扩散模型用于基于这些材料设计双漂移区(DDR)灭肌。从结果中,发现4H-SiC的RF功率超过INP的26倍,而不是基于WZ-GaN的Impatt二极管的4倍。类似地,与4H-SiC(29.5dB)和INP(31.5dB)相比,WZ-GaN具有约32.6dB的噪声。与基于INP和WZ-GaN的设备相比,具有中等噪声的4H-SiC的显着RF功率的产生更好。出色的结果表明,基于4H-SIC的灭绝二极管是未来的太赫兹来源。

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