Evaluation of 200 mm MPTI floating head with pressure zone control

摘要

For next generation IC production the need for advanced high performance polishing heads has increased. This demand is not only to obtain flat removal profiles but also to accommodate the wafer deposition profiles and provide a post CMP remaining flat profile. A polish head with varied control zone is required to achieve this goal. This study is to evaluate the performance of a MPTI floating head with varied pressure control zones. The test results demonstrate that this multi-zone control head can produce not only flat removal profiles but also flat post-CMP remaining profiles.