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Temperature coefficients of material properties for electrodeposited MEMS

机译:电沉积MEMS的材料性能温度系数

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This paper presents the use of micromachined differential capacitive strain sensors to investigate mechanical properties of electroplated Ni deposited under two different conditions on Si and glass substrates. The thermal expansion coefficient (α), Young's modulus, and residual strain were studied as a function of temperature. The measured α was 8-16 ppm/K over 23-150°C; the residual strain changed from neutral to -880 microstrain over 23-100°C in one case and +68.5 microstrain to -420 microstrain over 23-130°C in another case; and the Young's modulus ranged from 115-135 GPa at room temperature. The sensitivity of the device to structural non-idealities was evaluated by numerical modeling.
机译:本文介绍了使用微机械型差动电容性应变传感器来研究沉积在Si和玻璃基板上的两个不同条件下沉积的电镀Ni的机械性能。作为温度的函数研究了热膨胀系数(α),杨氏模量和残留菌株。测量的α超过23-150°C的8-16ppm / k;在一个壳体中,在一个壳体中从中性到-880微米菌塞发生在23-100°C中,在另一个情况下以23-130°C的+68.5微微陶器达到-420微米菌料;而年轻的模量在室温下的115-135 GPA。通过数值建模评估了装置对结构非理想的敏感性。

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