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Temperature coefficients of material properties for electrodeposited MEMS

机译:电沉积MEMS材料性能的温度系数

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This paper presents the use of micromachined differential capacitive strain sensors to investigate mechanical properties of electroplated Ni deposited under two different conditions on Si and glass substrates. The thermal expansion coefficient (/spl alpha/), Young's modulus, and residual strain were studied as a function of temperature. The measured a was 8-16 ppm/K over 23-150/spl deg/C; the residual strain changed from neutral to -880 microstrain over 23-100/spl deg/C in one case and +68.5 microstrain to -420 microstrain over 23-130/spl deg/C in another case; and the Young's modulus ranged from 115-135 GPa at room temperature. The sensitivity of the device to structural non-idealities was evaluated by numerical modeling.
机译:本文介绍了使用微机械差分电容应变传感器来研究在两种不同条件下沉积在Si和玻璃基板上的电镀Ni的机械性能。研究了热膨胀系数(/ spl alpha /),杨氏模量和残余应变与温度的关系。在23-150 / spl℃/℃下测得的a为8-16ppm / K;在一种情况下,残余应变在23-100 / spl deg / C下从中性变为-880微应变,在另一种情况下,残余应变在23-130 / spl deg / C上从+68.5微应变变为-420微应变。室温下的杨氏模量为115-135 GPa。通过数值建模评估了器件对结构非理想性的敏感性。

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