'SAMs meet MEMS':surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

摘要

Ultrathin organic self-assembled monolayers were used to functionalize surfaces prior to replication and de-molding processes. This technique is useful for many MEMS related applications, SPM probe fabrication using nanomolding, double side patterned MEMS structures, unconventional patterning of polymer devices, contamination-free electrode formation, etc. SAMs are used as a releasing agent without sacrificial layer etching for surface micro-machined MEMS structures allowing to replicate structures down to the nanometer scale. This technique enables furthermore to directly transfer a μCP SAM pattern into a metal structure.