Microwave frequency crosstalk model of redistribution line patterns on wafer level package

机译：微波频率串扰模型晶圆级包装中的再分配线图案模型

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In this paper, we firstly report the crosstalk model of redistribution lines on Wafer Level Package over 5 GHz. The extracted mutual inductance and mutual capacitance have the maximum values of 22OpH/cm and 98.2fF/cm, respectively.

机译：在本文中，我们首先在5 GHz上报告了晶圆级封装上的再分配线的串扰模型。提取的互感和互电容分别具有22oph / cm和98.2ff / cm的最大值。

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《Topical Meeting on Electrical Performance of Electronic Packaging》|2001年||共4页
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Myunghee Sung; Namhoon Kim; Junwoo Lee; Baekkyu Choi;
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中图分类 TN305.94-53;
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专利

1. Microwave frequency crosstalk model of redistribution line patterns on wafer level package [J] . Myunghee Sung, Namhoon Kim, Junwoo Lee, IEEE Transactions on Advanced Packaging . 2002,第2期

机译：晶圆级封装上的重新分布线图案的微波串扰模型
2. Microwave frequency crosstalk model of redistribution line patterns on wafer level package [J] . Myunghee Sung, Namhoon Kim, Junwoo Lee, IEEE Transactions on Advanced Packaging . 2002,第2期

机译：晶圆级封装上的重新分布线图案的微波串扰模型
3. Microwave frequency interconnection line model of a wafer level package [J] . Junwoo Lee, Woonghwan Ryu, Jingook Kim, IEEE Transactions on Advanced Packaging . 2002,第3期

机译：晶圆级封装的微波频率互连线模型
4. Microwave frequency crosstalk model of redistribution line patterns on Wafer Level Package [C] . Myunghee Sung, Namhoon Kim, Junwoo Lee, Electrical Performance of Electronic Packaging, 2001 . 2001

机译：晶圆级封装上的重新分布线图案的微波串扰模型
5. Wafer-level packaging and frequency trimming by localized mass deposition. [D] . Chang-Chien, Patty Pei-Ling. 2002

机译：晶圆级封装和通过局部质量沉积进行频率修整。
6. On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers [O] . Ali Roshanghias, Marc Dreissigacker, Christina Scherf, 2020

机译：采用喷墨印刷重新分布层对电容式微机械超声换能器（CMUT）的扇出晶圆级包装的可行性
7. Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging [O] . Yuji Okada, Atsushi Fujii, Kenta Ono, 2020

机译：扇出晶圆级包装中重新分配层有限元分析（FEA）的可靠性模拟

Microwave frequency crosstalk model of redistribution line patterns on wafer level package

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