BIST TPG for combinational cluster (glue logic) interconnect testing at board level

摘要

Due to the expense and complexity of boundary scan architecture (BSA) Circuitry, non-boundary scan ICs (cluster ICs) are still used in modern circuit boards. A novel BIST architecture and a TPG design methodology to program this architecture are presented for testing inter-IC interconnects among combinational cluster ICs via IEEE 1149.1 BSA at board level. The two main issues that are tackled are (1) safe testing, i.e., avoidance of conflicts at all multi-driver nets, and (2) obtaining complete coverage of all detectable faults in the interconnect. We have proposed a realistic model of interconnects that contain combinational cluster ICs, identified test requirements that must be satisfied by the TPG to achieve the above objectives, and developed a new TPG architecture that satisfies these test requirements. We have theoretically proven that the proposed technique guarantees safe and comprehensive testing of cluster interconnects and also demonstrated this fact via its applications to a few example circuits.