Compositionally modulated metal multilayers and alloys (CMMs and CMAs) have been gaining importance because of their unusual physical and electronic properties. Most previous work on CMAs has been focused on understanding the effect of substrate, composition and thickness of modulations, combination of metals, etc. on material properties. Some of the important processing parameters for CMMs and CMA electrodeposition are fluid hydrodynamics and current waveform. However, the role of these two engineering parameters during CMA deposition is less understood. In this investigation, copper-nickel metal multilayers have been plated from stagnant and stirred solutions with either dual pulse (DP) current or by a displacement reaction (DR). Isothermal remanent magnetism and gyroremanent magnetism measurements have been carried out to characterise the difference in properties of CMMs plated with the two different kinds of agitation and waveforms. It has been found that copper-nickel multilayers plated under stagnant conditions produce alloyed deposits, whereas metal multilayers are produced when agitation is used. Magnetic properties of deposits plated by dual pulses were found to be significantly different from those obtained by displacement reaction.
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