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首页> 外文期刊>Applied Surface Science >Ni-P/Zn-Ni compositionally modulated multilayer coatings - Part 1: Electrodeposition and growth mechanism, composition, morphology, roughness and structure
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Ni-P/Zn-Ni compositionally modulated multilayer coatings - Part 1: Electrodeposition and growth mechanism, composition, morphology, roughness and structure

机译:Ni-P / Zn-Ni成分调制的多层涂层-第1部分:电沉积和生长机理,组成,形态,粗糙度和结构

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The Ni-P/Zn-Ni compositionally modulated multilayer coatings CMMCs were electrodeposited from a single bath by switching the cathodic current density. The composition, surface morphology, roughness, layers growth pattern as well as the phase structure of deposits were extensively studied via SEM, EDS, AFM and XRD analysis. Effects of bath ingredients on the electrodeposition behavior were analyzed through cathodic linear sweep voltammetry. Although the concentration of Zn2+ in bath was 13 times higher than Ni2+, the Zn-Ni deposition potential was much nearer to Ni deposition potential rather than that of Zn. Addition of NaH2PO2 to the Ni deposition bath considerably raised the current density and shifted the crystallization potential of Ni to more nobble values. Codeposition of P with Zn-Ni alloy lead to crack formation in the monolayer that was deposited in 60 mA/cm(2). However, the cracks were not observed in the Zn-Ni layers of multilayers. Zn-Ni layers in CMMCs exhibited a three-dimensional pattern of growth while that of Ni-P layers was two- dimensional. Also, the Ni-P deposits tends to fill the discontinuities in Zn-Ni layers and performed leveling properties and lowered the surface roughness of Zn-Ni layers and CMMCs. Structural analysis demonstrated that Ni-P layers were amorphous and the Zn-Ni layers exhibited crystallite phase of Zn11Ni2. Thus, the Ni-P/Zn-Ni CMMCs comprised of alternate layers of amorphous Ni-P and nanocrystalline Zn Ni. (C) 2018 Elsevier B.V. All rights reserved.
机译:通过切换阴极电流密度,从单个镀液中电沉积Ni-P / Zn-Ni组成调制的多层涂层CMMC。通过SEM,EDS,AFM和XRD分析对沉积物的组成,表面形貌,粗糙度,层生长模式以及相结构进行了广泛的研究。通过阴极线性扫描伏安法分析了镀液成分对电沉积行为的影响。尽管镀液中的Zn2 +浓度比Ni2 +高13倍,但Zn-Ni的沉积电势比Zn的要近得多。将NaH2PO2添加到Ni沉积浴中可显着提高电流密度,并将Ni的结晶电位转移到更多的Nobble值。 P与Zn-Ni合金的共沉积会导致单层以60 mA / cm(2)沉积的形式形成裂纹。但是,在多层的Zn-Ni层中未观察到裂纹。 CMMC中的Zn-Ni层表现出三维生长模式,而Ni-P层则表现为二维生长模式。而且,Ni-P沉积物趋向于填充Zn-Ni层中的不连续性并具有流平性,并降低Zn-Ni层和CMMC的表面粗糙度。结构分析表明,Ni-P层为非晶态,Zn-Ni层显示为Zn11Ni2的微晶相。因此,Ni-P / Zn-Ni CMMC由非晶态Ni-P和纳米晶体Zn Ni的交替层组成。 (C)2018 Elsevier B.V.保留所有权利。

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