Electrodeposition of Cu/CoNi(Cu) GMR Superlattices

摘要

Cu/CoNi(Cu) GMR superlattices were electrodeposited from a single sulfamate electrolyte containing Rochelle salt, at pH 6.4, by a triple current pulse deposition technique. The influence of three different substrates, namely Si/NiFe20%, Si/ITO (indium tin oxide) and Si/Cr, on the crystalline structure, the bath electrokinetic behavior and the GMR effect were examined. The electrodic kinetic behavior was characterized with square current pulses overimposed during layer growth. Structure and surface morphology were characterized by X-ray diffraction and Scanning Electron Microscopy. The relations between the growth properties of Cu/CoNi(Cu) superlattices and the electrokinetic behavior during deposition are pointed out and discussed with reference to the observed multilayers GMR effects.