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SIMULATION OF PCB PARASITIC INFLUENCES IN POWER ELECTRONICS MODULES

机译:电力电子模块中PCB寄生物影响的仿真

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This paper presents a step by step method of analyzing the influence of the parasitic elements of a Printed Circuit Board (PCB) on a high power push-pull DC-DC converter. For the right functionality of the push-pull bridge converter is essential to assure a perfect symmetry of the circuit. Also, because of higher power levels involved in the present case study the parasitics elements must be kept at lowest possible values. Our intention is to analyze and simulate the influences of the PCB layout on converter behavior. For the parasitic estimation of the PCB traces and copper zones we used the IE3D electromagnetic full wave planar simulator. Based on the lumped model of the passive interconnection structure a SPICE transient analysis was realized. The analysis results permit us to observe the voltage and current wave shapes at the switching elements and to estimate the functionality of the circuit. The method of analysis is not time effective but permits us a good prediction of the influences caused by the PCB parasitics on a real circuit behavior.
机译:本文逐步逐步分析印刷电路板(PCB)寄生元件对高功率推挽DC-DC转换器的影响的方法。对于推挽式桥接器转换器的正确功能对于确保电路的完美对称是必不可少的。而且,由于当前案例研究涉及的较高功率水平,因此寄生元件必须保持在尽可能低的值。我们的目的是分析和模拟PCB布局对转换器行为的影响。对于PCB迹线和铜区的寄生估计,我们使用IE3D电磁全波平面模拟器。基于被动互连结构的集总模型,实现了Spice瞬态分析。分析结果允许我们观察开关元件处的电压和电流波形并估计电路的功能。分析方法不是时间有效,但允许我们对PCB寄生菌引起的影响良好地预测了对实际电路行为的影响。

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