In this paper, we review and highlight the central role that infrared spectroscopy has played in elucidating the microscopic details of the bonding and exfoliation processes and we introduce a novel technique for imaging and measuring strain with submicron resolution. The mechanism for chemical bond formation between two interfaces is derived from monitoring the chemical evolution of interfacial species as a function of annealing. The mechanism for silicon shearing upon H-implantation/annealing is understood as an evolution of H-passivated point defects into H-stabilized internal surfaces, together with H{sub}2 formation. The nucleation and propagation of microbubbles that form prior to exfoliation is imaged with x-rays and a detailed strain map in the vicinity of bubbles just prior to exfoliation can be made.
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