Research on Effect of Soldering Temperature and Time on Intensity of Sn-Ag-Cu (In) Solder without Plumbum

摘要

The background and development of Pb-free solder used in electronic products is introduced in this paper. Then the problem is analyzed among the research of solder without Pb (plumbum). In this paper, the intensity experiment of Sn-Ag-Cu (In) without plumbum is reported, which is according to the national standard of Russia ГОСТ 28830-90. The effects of soldering temperature and time on jointing intensity are analyzed in detail. By the processing the result of experiment, a mathematical model of jointing is presented, and the optimal soldering temperature and time are proposed based on the mathematical model.