Differential Scanning Calorimetry (DSC) in dynamic and isothermal modes was used to derive a model for the kinetics of cure of Cytec FM73 adhesive. Heat evolution with time and total heat of reaction of the adhesive system was measured during dynamic DSC scans at heating rates of 2, 5, and 10 °C/min. Isothermal heat flow measurements were then made at temperatures of 363, 368, 378, 393, 398, and 408 K and the heat of reaction (H{sub}R), the rate of cure (dα/dt), and the degree of cure (α) calculated at each temperature. This data was used to develop an expression for resin cure rate as a function of degree of cure and temperature. Best results were obtained using an Arrhenius-based semi-empirical model, with constants calculated using a Levenberg-Marquardt algorithm. Good agreement was found between experimental measurements and model predictions.
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