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Low-power silicon microheaters on a thin dielectric membrane with thick-film sensing layer for gas sensor applications

机译:低功耗硅微热器在薄电介质膜上,具有厚膜传感层,用于气体传感器应用

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We report on the design, fabrication, and characterisation of a microheater module for chemoresistive, metal-oxide semiconductor gas sensors. The microheater consists of a dielectric stacked membrane with a polysilicon resistor heater element as well as a polysilicon temperature-sensing element. The geometry of both, the membrane and the heater have been optimised by means of finite element computer simulation in order to maximise heating efficiency. These devices complete of the sensing layer require only 30 mW to achieve a temperature of about 400 °C, while conventional thick film sensors fabricated on alumina substrates require typically more than 500 mW to reach the same working temperature. The proposed micromachining technology allows low-power microheaters to be fabricated at low cost and compatible with mass production technology; furthermore silicon micromachining is potentially suitable for the integration of the sensing and the heating element as well as the required electronics into the same battery-operated portable microsystem. The calibration curve of the sensor prototypes for various gases will be presented together with some future development about the microheater structure.
机译:我们报告了微热器模块的设计,制造和表征,用于化学致力化的金属氧化物半导体气体传感器。微热器由具有多晶硅电阻器加热器元件以及多晶硅温度传感元件的介电堆叠膜组成。通过有限元计算机模拟优化了两者,膜和加热器的几何形状,以最大化加热效率。这些器件完整的感测层只需要30mW以达到约400℃的温度,而在氧化铝基板上制造的常规厚膜传感器通常需要500mW以达到相同的工作温度。所提出的微加工技术允许低功率微热器以低成本制造,并与大规模生产技术兼容;此外,硅微机器可能适用于传感和加热元件的整合以及所需的电子设备进入相同的电池供电的便携式微系统。各种气体的传感器原型的校准曲线将与一些关于微热器结构的未来发展一起呈现。

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