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Standard CMOS implementation of a multiple-valued logic signed-digit adder based on negative differential-resistance devices

机译:基于负差分电阻器件的多值逻辑签名数字加法器的标准CMOS实现

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This paper presents MOS-NDR, a new prototyping technique for multiple-valued logic circuits combining MOS transistors and multipeak negative differential-resistance (NDR) devices such as resonant-tunneling diodes (RTDs). MOS-NDR emulates the folded current-voltage characteristics of NDR devices such as RTDs using only NMOS transistors. MOS-NDR has enabled the development of a fully integrated multi-valued signed-digit full adder (SDFA) circuit by means of a standard 0.6-micron CMOS process technology. The prototype has been fabricated and correct operation has been verified. The circuit dimensions are 123.75 by 38.7 microns, which is more than 15 times smaller than the area required by the equivalent hybrid RTD-CMOS prototype. The propagation delay of the hybrid RTD-CMOS design is estimated to be close to six times higher than that of the MOS-NDR implementation.
机译:本文介绍了MOS-NDR,一种用于多值逻辑电路的新型原型技术,用于组合MOS晶体管和多焦点负差分电阻(NDR)诸如谐振隧道二极管(RTD)的多焦数装置。 MOS-NDR仅使用NMOS晶体管模拟NDR器件的折叠电流 - 电压特性,例如RTD。 MOS-NDR通过标准的0.6微米CMOS工艺技术开发了通过标准的0.6微米CMOS工艺技术开发完全集成的多值签名数字全加法器(SDFA)电路。已经制造了原型并验证了正确的操作。电路尺寸为123.75乘38.7微米,比相同的杂交RTD-CMOS原型所需的区域小超过15倍。估计混合动力RTD-CMOS设计的传播延迟比MOS-NDR实现高度高六倍。

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