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Conformal growth of III-Vs on Si: from low defect density materials to advanced devices

机译:Si的III-VS的共形生长:从低缺陷密度材料到先进器件

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Conformal epitaxy is a growth technique capable of yielding very low dislocation density heteroepitaxial materials, such as III-V films on Si. In this technique, the III-V material grows parallel to the silicon substrate, from the edge of a previously deposited III-V seed, the vertical growth being stopped by an overhanging capping layer. As an example, conformal GaAs layers on Si, presenting dislocation densities below 10~5cm~(-2), have been obtaiend using selective chloride or hydride vapor phase epitaxy. These layers have then been used as high quality templates for subsequent vertical MBE regrowth of active structures. We first report on the integration of surface-emitting microcavity LEDs with their silicon drivers using this conformal growth technique. The high efficiency of the integrated LEDs and the negligible impact of the integration process on the drivers performance prove the efficiency of this procedure and its compatibility with advanced CMOS technology. Pseudomorphic GaAlAs/GaInAs HEMTs were also integrated on silicon substrates using this conformal technique: DC and RF characteristics highly improved compared to direct epitaxy on Si and close to reference ones on GaAs substrate were obtained. First relaisations of conformal epitaxy by MOCVD and of lateral devices on various types of substrates by modulating during conformal growth both doping and composition of the materials are finally presented.
机译:保形外延是一种生长技术,能够产生非常低的位错密度异质材料,例如Si上的III-V膜。在该技术中,III-V材料从预先沉积的III-V种子的边缘平行于硅衬底而平行地生长,垂直生长被悬垂的覆盖层停止。作为一个例子,Si上的共形GaAs层,呈现低于10〜5cm〜(-2)的位错密度,使用选择性氯化物或氢化物气相外延一直钝化。然后,这些层被用作高质量模板,用于随后的有源结构的垂直MBE再生。我们首先报告了使用这种保形生长技术与其硅驱动器的表面发射微腔LED的集成。集成LED的高效率和集成过程对司机性能的可忽略影响证明了该程序的效率及其与高级CMOS技术的兼容性。使用这种保形技术,在硅基衬底上也集成了假晶的Gaalas / Gainas Hemts:与Si上的直接外延相比,DC和RF特性得到高度改善,并获得了GaAs基板上的参考值。首先通过调节在保形生长期间通过调节掺杂和材料的各种类型基质上的MOCVD和横向装置的首先重新定义。

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