Theoretical and experimental studies conducted for the purpose of development and optimization of GaN-based Gunn diodes for THz are reported. GaN Gunn-diode oscillators with 0.3μm-thick GaN diodes are expected to have fundamental frequency of 750GHz and power density of 3x10~5W/cm~2. GaN In an effort to verify the experimental characteristics of GaN Gunn diodes, device layers were grown by MOCVD and special device patterns have been developed. On-wafer characterization of the fabricated GaN negative differential resistance (NDR) diodes revealed increased power capability compared with GaAs Gunn devices The processing necessary for realization of such diodes with increased power handling is also addressed.
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机译:据报道了用于开发和优化GaN的Gunn二极管的理论和实验研究。 GaN Gunn-Diode振荡器,具有0.3μm厚的GaN二极管的频率为750GHz,功率密度为3×10〜5W / cm〜2。 GaN努力验证GaN Gunn二极管的实验特性,通过MOCVD生长了装置层,并且已经开发了特殊的装置图案。与GaAs Gunn设备相比,制造的GaN负差分电阻(NDR)二极管的晶片表征揭示了增加的功率能力,该处理对于实现这种二极管具有增加的功率处理所需的处理。
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