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A SIMPLE DETERMINATION METHOD OF IN-PLANE POISSON'S RATIO FOR MEMS MATERIALS BY MEANS OF ON-CHIP PURE BENDING TEST

机译:通过片上纯弯曲试验的MEMS材料的平面内泊松比的简单测定方法

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This paper describes a novel and simple method for measuring in-plane Poisson's ratio of film materials. We designed on-chip pure-bending test specimen where pure-bending deformation can be produced via torsion bar by application of normal load to loading lever. During pure-bending, the interference pattern of a family of hyperbola, corresponding to the contour lines of a film specimen in the out-of-plane direction, is observed with optical interferometer. In-plane Poisson's ratio of a film specimen can be obtained from only the angle of asymptotes of hyperbola consisting of the interference lines, regardless of other material constants. The measured Poisson's ratio of single crystal silicon (SCS) specimen was 0.063 on average, in close agreement within 2 % deviation from analytical value.
机译:本文介绍了一种用于测量薄膜材料比例的新颖简单的方法。我们设计了片上纯弯曲试样,可以通过施加正常载荷来通过扭杆生产纯弯曲变形。在纯弯曲期间,用光学干涉仪观察到在外平方向外方向上的膜样品的轮廓线的双曲线系列的干涉图案。无论其他材料常数如何,都可以仅从外曲线组成的双曲线的渐近角度来获得薄膜样本的比率。测量的泊松单晶硅(SCS)样本的比例平均为0.063,在2%偏差与分析值的偏差范围内。

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