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Preparation and properties of fluorinated amorphous carbon films by ECR-CVD method

机译:ECR-CVD法制备氟化非晶碳膜的制备与性能

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Fluorinated amorphous carbon films (a-C:F) with a dielectric constant of 2.2 were prepared for intermetal dielectrics (IMD) for ULSI technology by ECR-CVD method. Current-voltage measurements of the a-C:F films demonstrate very good dielectric properties. FTIR absorption spectrum reveals that the a-C:F film is composed mainly of CF_n (n=1-3) structure. The deposition rate decreases with increasing the substrate temperature. This is attributed to the poor thermal stability of the a-C:F film according to TDS results.
机译:通过ECR-CVD方法制备具有介电常数为2.2的介电常数为2.2的氟化非晶碳膜(A-C:F)。通过ECR-CVD方法为ULSI技术进行化学电介质(IMD)。 A-C:F薄膜的电流电压测量结果表明了非常好的介电性能。 FTIR吸收光谱显示A-C:F膜主要由CF_N(n = 1-3)结构组成。随着基板温度的增加而降低沉积速率。这归因于根据TDS结果的A-C:F胶片的热稳定性差。

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