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Low stress anhydride molding compound for RF applications

机译:用于RF应用的低应激酐模塑化合物

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Anhydride cured epoxy molding compounds after inherently high glass transition temperature (Tg), high adhesion and low dielectric constant at a moderate cost. However, historical drawbacks of anhydride-cured compounds (poor moldability and moisture resistance, high coefficient of thermal expansion, shrinkage and brittleness) have limited their use for surface mount applications. This paper details the development of new anhydride compounds designed specifically for surface mount power applications.
机译:酸酐固定的环氧模塑化合物在固有的高玻璃化转变温度(Tg),高粘附性和低介电常数以适度的成本。然而,酸酐固化化合物的历史缺点(可模塑性和耐湿性差,高热膨胀系数,收缩和脆性)限制了其用于表面安装应用的用途。本文详细介绍了专为表面安装电力应用而设计的新型酸酐化合物的开发。

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