Low-Pressure-Transfer Molding of Silicon Rubber Compounds

摘要

Long, thin silicon rubber parts have been molded in small volumes using a transfer molding technique which eliminates voids as well as the longitudinal parting line. The process uses inexpensive tooling and does not require the use of a press. The tooling features a resin pocket which doubles as the lower mold-half. As the upper mold force descends into the pocket, the resin is forced upward through the cavity, effectively evacuating it. Normal curing and demolding follow. 6 figures. (ERA citation 08:032093)