customizable Multichip Modules For High-G Telemetry Applications

摘要

The Microelectronics and computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM's) in co-operation with the applied Physics Laboratory (APL), has investigate the survivability of this technology in high-g applications. comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.