Flip chip die attach development for multichip mechatronics power packages

摘要

New package innovations are needed to address the next generation system requirements of the automotive market. Enhanced system functionality from semiconductor components and overall cost reduction demands drive multichip package solutions. The use of semiconductor devices to switch, control and monitor high current loads will integrate logic and power devices on a common substrate with requirements for effective power dissipation, current carrying capability and fine board conductor features for the control device and interconnections. To achieve these goals, Motorola's Advanced Interconnection Systems Laboratory in Munich has developed a new package concept, a multichip mechatronics power package utilizing flip chip die attach technology and electroplated eutectic SnPb solder bumps. With the goal of delivery of an advanced package platform to cover different power levels in the system architecture, several substrate technologies were evaluated.