首页> 外文会议>International Conference on Indium Phosphide and Related Materials >Progress with 100 mm diameter In{sub}.53Ga{sub}.47As/InP wafer processing
【24h】

Progress with 100 mm diameter In{sub}.53Ga{sub}.47As/InP wafer processing

机译:在{sub} .53ga {sub} .47as / inp晶片处理中具有100 mm直径的进展

获取原文

摘要

Photodetector array results for InGaAs/InP epitaxial layers grown on 50 and 75 mm diameter InP substrates are presented. Best shunt-resistance area products for lattice-matched material exceed 100,000 ohm-cm{sup}2. X-ray topography resultsindicate that low defect density (<10,000 cm{sup}-2) iron-doped InP substrates are available in 100 mm diameter. Low dark current results were also obtained with a a "spin-on" zinc diffusion technique whereby the source of zinc is "spun-on" much likephotoresist.
机译:提出了在50和75mm直径INP基板上生长的InGaAs / InP外延层的光电探测器阵列。用于晶格匹配材料的最佳分流器电阻区域产品超过100,000欧姆-cm {sup} 2。 X射线地形结果indimate ind缺陷密度(<10,000cm {sup} -2)的铁掺杂INP基板,直径为100 mm。还通过“旋析”锌扩散技术获得了低暗电流结果,其中锌源是“旋转”的光照层。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号