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Profiled Poly-Silicon Films by Hot-Wire Chemical Vapour Deposition for Solar Cells on Cheap Metal Substrate

机译:通过廉价金属基质的太阳能电池的热线化学气相沉积成型多晶硅膜

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Films grown by Hot-wire CVD at high hydrogen dilution of SiH_4 (Poly1) showed a polycrystalline initial growth, though with high defect density and randomly oriented grains. The crystal columns consist of many small grains. Oxygen penetrates deep into the film through large voids between the columns perpendicular to the substrate. films grown with low hydrogen dilution (Poly2) showed device quality (purely intrinsic nature, only (220) oriented growth) but with an incubation phase during which amorphous initial growth takes place. The presence of only 2000 cm~(-1) IR vibration and a high temperature hydrogen evolution (~600 °C) proves the compact structure which inhibits oxygen incorporation ([O]=5 * 10~(18) cm~(-3) from SIMS) into the film. A new approach was used to integrate these two growth regimes to make profiled poly-Si layers in which a Poly1 layer of fixed thickness acts as a seed layer, on top of which the Poly2 is deposited. The top layer selectively grows along the (220) direction even though the grains in the seed layer are randomly oriented. The top layer is compact with V shaped columns consisting of twinned grains with a height approaching the layer thickness. A sharp reduction in void content is observed at the transition from seed layer to top layer. The profiled films show complete absence of amorphous incubation phase. Cells incorporating the profiled poly-Si:H films were made on stainless steel substrates in the configuration SS/n-μc-Si:H(PECVD)/i-poly-Si:H(HWCVD)/p-μc-Si:H(PECVD)/ITO. An efficiency of 4.41% and a FF of 0.607 have been achieved. A current density of 19.95 mA/cm~2 is generated with an only ~1.22 μm thick i-layer which was deposited at a rate of more than 5A/s.
机译:在SiH_4(POLY1)的高氢稀释通过热丝CVD生长的膜表现出多晶初始生长,尽管具有高的缺陷密度和随机取向的晶粒。结晶柱由许多小杂粮。氧深入渗透膜通过列之间大的空隙垂直于衬底。低氢稀释(POLY2)生长的膜显示装置的质量(纯粹内在性质,只有(220)取向生长),但在此期间,无定形的初始生长发生的温育阶段。的仅2000厘米〜(-1)IR振动和高温氢演进(〜600℃)的存在证明了紧凑的结构,其抑制氧掺入([O] = 5×10〜(18)厘米〜(-3 )从SIMS)到膜中。一种新方法被用来集成这些两种生长机制,使在该固定厚度的POLY 1层作为种子层,在其上的POLY2沉积顶部异型多晶Si层。顶层沿即使在种子层中的晶粒随机取向的(220)方向上有选择地生长。顶层是紧凑采用V形柱由孪晶颗粒随着接近层厚度的高度。在空隙含量急剧减少在从晶种层到顶层的过渡是观察。该异形片显示完全没有非晶孵化阶段的。掺入成型多晶硅细胞:H(PECVD)/ I-多晶Si:H(HWCVD)苯乙烯/对 - 微晶硅:H膜在配置SS /正微晶硅不锈钢基体上制成ħ (PECVD)/ ITO。 4.41%的效率和0.607一个FF已经实现。 19.95毫安/厘米〜2与一个只〜1.22微米厚的i层,其在比图5A更速率沉积生成/ s的电流密度。

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