Abrasive capacity of thin film diamond structures

摘要

Diamond structures were produced with a three-step replication technique. First a mould is created using standard silicon wafer patterning technology. Diamond was then deposited in a CVD process onto the mould surface. The last step is to electroplate a nickel backing on the diamond film and remove the silicon mould. Using this technique, diamond pyramids of different size and lateral distribution were produced. The wear rates of brass, steel, aluminium oxide and silicon nitride caused by the diamond structures were compared with that of commercial silicon carbide grinding paper in a pin-on-disc configuration. The diamond pyramids abraded with a much higher rate than the silicon carbide grinding paper on all materials except brass. This was especially pronounced for aluminium oxide.