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Studies on Properties and Structure of Electroless Plating Tin Coating

机译:化学镀锡型镀锡的性能与结构研究

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The composition and structure of electroless tin coating were analyzed by SEM and X-ray diffraction. In the meantime, porosity, solderability and extensibility were determined by physical and chemical methods. The results showed that the porosity of the tin coating increases with the rise of bath temperature and decreases as the plating time rises. Solderability is improved with the rise of thickness of tin coating, and decreases when the tin deposit is heated at 180 ~ 200°C. The crystalline grain size becomes bigger and bigger with increasing plating time or bath temperature or coating thickness. X-ray diffraction indicates that only Cu and β-Sn phases show up in the diffraction patterns. Tin coating has a strong joint force with copper substrate and excellent function of electrochemical protection as anode coating.
机译:通过SEM和X射线衍射分析化学镀锡的组成和结构。 同时,通过物理和化学方法确定孔隙率,可焊性和可伸展性。 结果表明,随着电镀时间升高,锡涂层的孔隙率随着浴温的升高而增加,随着电镀时间升高而降低。 随着锡涂层的厚度的升高,可焊性改善,当锡沉积物在180〜200℃加热时,减少。 结晶晶粒尺寸随着电镀时间或浴温或涂层厚度而变大而越大。 X射线衍射表明仅Cu和β-Sn相位在衍射图案中显示出来。 锡涂层具有强大的关节力,具有铜基材和作为阳极涂层的电化学保护的优异功能。

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