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Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages

机译:高级测量和建模技术对球栅阵列封装的电力特性建模技术

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Advanced measurement and modeling techniques are proposed in both the frequency domain and time domain to establish the high-frequency/high-speed equivalent models of Ball Grid Array (BGA) packages. In consideration of the adjacent coupled traces of the packages, the electrical parameters that are found include characteristic impedance, coupling coefficient, and propagation delay for the equivalent coupled transmission-line models, and self inductance, mutual inductance, loaded capacitance, and mutual capacitance for the equivalent lump models.
机译:在频域和时域中提出了先进的测量和建模技术,以建立球网阵列(BGA)封装的高频/高速等效模型。考虑到封装的相邻耦合迹线,找到的电气参数包括用于等效耦合的传输线模型的特征阻抗,耦合系数和传播延迟,以及自感,互感,负载电容和相互电容等效的肿块模型。

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