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Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

机译:低于500 MHz的S参数测量对球栅阵列封装的电学表征

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Ball grid array (BGA) packages have been characterized from one port S-parameter measurements by shorting and opening the connection on the ball side of BGA packages. Transmission line parameters (resistance, inductance and capacitance) using the /spl Gamma/ equivalent circuit model are extracted from the measured S/sub 11/ parameter. Extracted resistances are strongly dependent on frequency, but extracted inductances and capacitances are nearly constant up to 500 MHz. Extracted capacitances are well matched to those measured from an LCR meter and calculated from a three-dimensional (3-D) simulator, Capacitance in a transmission line plays an important role in electrical performance for packages so that we may model a transmission line as a single capacitor. Extracted capacitances using the single capacitor model also well represent the measured S/sub 11/. These results suggest that the single capacitor model can be efficiently used for the transmission line model in BGA packages up to 500 MHz.
机译:球栅阵列(BGA)封装的特点是通过短路和断开BGA封装的球侧连接来进行单端口S参数测量。从测量的S / sub 11 /参数中提取使用/ spl Gamma /等效电路模型的传输线参数(电阻,电感和电容)。提取的电阻在很大程度上取决于频率,但是提取的电感和电容在500 MHz以下几乎恒定。提取的电容与通过LCR表测量并通过三维(3-D)仿真器计算得出的电容非常匹配,传输线中的电容在封装的电气性能中起着重要作用,因此我们可以将传输线建模为单电容器。使用单电容器模型提取的电容也很好地代表了测得的S / sub 11 /。这些结果表明,单个电容器模型可以有效地用于高达500 MHz的BGA封装中的传输线模型。

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