Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed planes, a set of test coupons was characterized. The multiconductor interconnects were modeled as cascaded lossy transmission lines. The interconnect models were validated by performing time- and frequency-domain simulations to match TDR and S-parameter measurements. The validation results from both the time and frequency domains show good agreement between the measured and simulated data. Using the interconnect model developed from the characterization results of the first set of test coupons, crosstalk models were built for multiconductor interconnects with meshed planes. To validate the crosstalk models, a second set of test coupons was analyzed. The crosstalk at both ends of each structure was measured. The measured results were compared with results from simulations. Reasonable agreement was seen between measured and simulated results and the discrepancy is being investigated further.
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