ACCELERATED RELIABILITY TEST TECHNIQUES USED TO FIND DEFECTS WITHIN PRINTED CIRCUIT BOARDS

摘要

Accelerated reliability testing is one of the fastest growing segments of the testing industry because it enables the user to ruggedize products, to accelerate product introduction, and to introduce mature products into the market. The two principle stresses used during accelerated reliability testing are rapid temperature transitions and QmniAxial (6 degree-of-freedom) random vibration. In addition to these, other stresses that are often used are power cycling and voltage and frequency margining. This paper illustrates how accelerated reliability testing was able to successfully find one of the most difficult failure modes to uncover, defects within printed circuit boards (PCB's).