Failure Analysis of Electronic and Microelectronic Components with a New Automatic Target Preparation System

摘要

The new automatic preparation system evaluated in this work can be used for the metallographic failure analysis on electric and microelectronic components. The desired preparation layers were achieved precisely and reproducibly with several specimens of the same kind. By hand, only experienced and skilled technicians can prepare such specimens of good quality, and still it is difficult and time consuming. Typically the specimens are at risk of being ground beyond the target and lost for further investigations. The automatic preparation system, however, allows the preparation of critical samples within a short time, with high precision and with excellent reproducibility.