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Failure analysis of electronic components and interconnection systems

机译:电子元件和互连系统的故障分析

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Purpose - The failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed. Design/methodology/approach - How the analytical techniques used for physical and chemical analysis, which include X-ray radiography, optical microscopy and scanning electron microscopy/energy dispersive X-ray spectroscopy, are used. Findings - Examples from recent case studies are given to illustrate the work. Originality/value - The paper demonstrates how the failure analysis of an electronic component or interconnection system is conducted, and what can be learnt from the investigation.
机译:目的-讨论电子组件和互连系统(例如集成电路,印刷电路板组件和混合设备)的故障分析。设计/方法/方法-如何使用用于物理和化学分析的分析技术,包括X射线射线照相,光学显微镜和扫描电子显微镜/能量色散X射线光谱。调查结果-列举了近期案例研究中的例子来说明这项工作。原创性/价值-本文演示了如何进行电子组件或互连系统的故障分析,以及从调查中学到的知识。

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