Detection of Local Cu-to-Cu Bonding Defects in Wafer-to-Wafer Hybrid Bonding using GHz-SAM

摘要

This paper demonstrates the application of GHz-SAM for the detection of local non-bonded regions between micron-sized Cu-pads in a wafer-to-wafer hybrid bonded sample. GHz-SAM is currently the only available non-destructive failure analysis technique that can offer this information on wafer level scale, with such high resolution.