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FIB Backside Circuit Modification at the Device Level, Allowing Access to Every Circuit Node with Minimum Impact on Device Performance by Use of Atomic Force Probing

机译:FIB在设备电平的回路电路修改,允许通过使用原子力探测对每个电路节点进行最小对设备性能的影响

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摘要

Direct measurements of circuit node signals without changing the performance of the circuitry are essential in modern FA but often impossible for recent IC technologies. This paper shows new methods, based on FIB backside circuit edit, allowing access to every existing circuit node at the device level, and discusses options for probing and discrete characterization.
机译:电路节点信号的直接测量不改变电路性能的现代FA中必不可少,但最近的IC技术通常是不可能的。本文基于FIB背面电路编辑,允许访问设备级别的每个现有电路节点,并讨论探测和离散表征的选项。

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