Profile clltrol of Sub-0.3 um contact etch features in a medium density oxide etch reactor

摘要

The fabrication of sub-0.3 #mu#m contacts and vias in oxide at high aspect ratio (> 5:1) presents new challenges not typically encountered at larger feature sizes and lower aspect ratio. Profile control is difficult in this regime. The appearance of bowed profiles is common and becomes more pronounced as the feature size shrinks. Bowed profiles are not acceptable in a manufacturing environment.