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COMPUTER SIMULATION OF IMPURITY GETTERING CAPABILITY IN SILICON FOR CURRENT GETTERING TECHNIQUES

机译:电脑仿真硅芯片硅涂层电流吸气技术

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Capability of impurity gettering in silicon is simulated numerically. The considered techniques are boron-gettering by heavily boron-doped p~+ substrates, thin polycrystalline silicon films on the backside of wafers (PBS), and internal gettering (IG) induced by oxygen precipitates. Dominant gettering mechanism of the boron-gettering and the that of PBS are segregation-induced types. We accurately determined equilibrium constants of the segregation reactions for iron gettering at various temperatures. Using the determined values of the equilibrium constants, and introducing iron diffusion phenomena, we have succeeded to predict an iron impurity concentration in a surface region during a device fabrication process. In case of the IG, it is essential to predict a size distribution function of oxygen precipitates which act as the gettering sites. Therefore we have developed an industrially practical computer simulation technique based on the Fokker-Planck equation to predict the size distribution function of the oxygen precipitates. The calculated results of the precipitation behavior agree well with the experimentally observed ones.
机译:在数值上模拟硅杂质吸气能力的能力。所考虑的技术是通过重硼掺杂的P〜+基材,薄的多晶硅膜在晶片(PBS)背面的薄多晶硅膜,并通过氧沉淀诱导的内部吸血管(Ig)。硼迷路的主导搬迁机制和PBS的偏离诱导类型。我们在各种温度下准确确定用于铁气体的偏析反应的平衡常数。使用确定的平衡常数的值,并引入铁扩散现象,我们成功地在器件制造过程中预测表面区域中的铁杂质浓度。在Ig的情况下,必须预测充当吸气部位的氧沉淀物的尺寸分布函数。因此,我们开发了一种基于Fokker-Planck方程的工业实用的计算机仿真技术,以预测氧气沉淀的尺寸分布函数。降水行为的计算结果与实验观察到的结果很好。

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