An Advanced Server System Design with 3-Dimensional Vaper Chamber Heat Sink Solution

摘要

As data explosion dramatically accelerating from IoT (Internet of Thing) edge devices, high performance server has been dominating deployment in the recent CSPs (Cloud Service Providers) data center for conquering the challenge of huge amount of data processing on cloud computing. Microprocessor architecture advance continues to involve with more core count, higher frequency, as well as larger on-die memory cache size, pursuing for higher computing performance while trading off with more power consumption. Nowadays, CSPs have been experiencing the power constraint challenge of high-performance server deployed for TCO (total cost ownership) efficiency in their traditional typical 4KW co-lo or 8KW self-built air-cooling data center where the infrastructures restructured for liquid cooling is unfeasible.This paper introduces an advanced server system design with 3D VC (3-Dimensional Vaper Chamber) heat sink for power constraint data center deployment. Compared with the traditional air-cooled heat sink solutions, 3D VC heat sink has better temperature uniformity and cost advantages. With the 3D VC thermal solution in server system design, CPU thermal performance can achieve 2°C improvement vs. the solution of traditional heat pipes and VC plates heat sinks, and the TCO saving is up to 15% to 20%.