Mechanistic Aspects Of The Relationship Between CMP Consumables And Polishing Characteristics

摘要

There is an emerging need to establish fundamental, mechanism-based, correlation(s) between process conditions, consumables (i.e., pads and slurriesA) and observed process performance in chemical-mechanical polishing (CMP). In this paper, we discuss such fundamental relationships, and present recent results of studies performed on pads, slurries and their interaction. Specifically, this paper will address the interaction between pads and slurries and the corresponding variation in pad hardness, morphology, microstructure and mechanical integrity, with slurry chemistry (pH). Our results show how parameters, such as removal rates, within wafer non-uniformity, and defectivity, are influenced by the chemistry of consumables and their progressive interaction during the CMP process.