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International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing

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1.Impact of slurry particle aggregation upon pad surface topography and film removal rate in chemical mechanical planarization

机译：浆料颗粒聚集对垫表面形貌和化学机械平面化薄膜去除率的影响
- 作者：Lei Zhong;Jerry Yang;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
2.CMP Applications for Sub-0.25#mu#m Process Technologies

机译：SUB-0.25＃MU＃M流程技术的CMP应用
- 作者：Dipankar Pramanik;Milind Weling;Xi-Wei Lin;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
3.Aggregate Behavior in Metal CMP Slurries

机译：金属CMP浆料中的聚合行为
- 作者：D.C. Tamboli;V.H. Desai;A. Dogariu;K.B. Sundaram;A.Maury;Y.Obeng;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
4.Characterization of concentrated CMP slurries by acoustic techniques

机译：声学技术浓缩CMP浆化的特征
- 作者：Melanie L. Carasso;Jorge L. Valdes;Linda A. Psota-Kelty;Linda J. Anthony;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
5.Chemical and structural characterization of aluminum oxide (Al_2O_3) slurries

机译：氧化铝（Al_2O_3）浆料的化学和结构表征
- 作者：M. Lauwidjaja;G. Popescu;K. Richardson;A. Dogariu;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
6.High speed polishing of silicon dioxide thin films using linear planarization technology

机译：使用线性平面化技术高速抛光二氧化硅薄膜
- 作者：Brian Thornton;Andy Nagengast;Jayanthi Pallinti;Anil Pant;Rahul Jairath;Wilbur Krusell;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
7.Characterization of the oxide CMP process for shallow trench isolation based advanced bicmos technologies

机译：基于沟槽隔离高级BICMOS技术的氧化物CMP工艺的表征
- 作者：John Damiano;Hong Tian;Asanga Perera;Chitra Subramanian;Jim Hayden;Barry Haygood;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
8.Non-contact post-CMP cleaning using a single wafer processing system

机译：使用单个晶片处理系统进行非接触式CMP清洁
- 作者：Michael B. Olesen;Brian Fraser;Cole Franlin;Mario Bran;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
9.Dual salicide and self-aligned metal gate formation for sub-0.25#mu#m CMOS technologies using CMP

机译：使用CMP的Sub-0.25＃Mu＃M CMOS技术的双母生和自对准金属浇口形成
- 作者：Milind Weling;Xi-Wei Lin;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
10.Aging effect in CMP slurries probed by multiple light scattering

机译：多光散射探测CMP浆料中的老化效应
- 作者：G. Popescu;M. Lauwidjaja;L. Denney;K. Richardson;A. Dogariu;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
11.Curvature-induced wafer down pressure distribution and its influence on chemical-mechanical polishing process

机译：曲率诱导的晶圆下压力分布及其对化学机械抛光过程的影响
- 作者：Wei-Tsu Tseng;Yui-Sheng Wang;Jyh-Hwa Chin;Wen-Chueh Pan;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
12.Treatment of alumina and silica CMP waste by electrodecantation and electrocoagulation

机译：电渗析和电凝氧化铝和二氧化硅CMP废物处理
- 作者：B.M. Belongia;P.D. Haworth;J.C. Baygents;S. Raghavan;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
13.Chemical-mechanical polishing of tungsten: an electrophoretic mobility investigation of alumina-tungstate interactions

机译：钨的化学机械抛光：氧化铝 - 钨酸盐相互作用的电泳迁移率调查
- 作者：K. Osseo-Asare;Aman Khan;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
14.A theoretical model for chemical-mechanical polishing of blanket wafers with soft pads

机译：软垫橡皮布晶圆化学机械抛光理论模型
- 作者：Frank G. Shi;Bin Zhao;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
15.Chemical-mechanical polishing of metals: the role of metal concentration gradient

机译：金属化学机械抛光：金属浓度梯度的作用
- 作者：K. Osseo-Asare;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
16.Mechanistic Aspects Of The Relationship Between CMP Consumables And Polishing Characteristics

机译：CMP消耗品与抛光特性之间关系的机械方面
- 作者：Y.S. Obeng;K.M. Forsthoefel;K.A. Richardson;R.H. Burton;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
17.Inhibiton of alumina particle deposition onto SiO_2 surfaces during tungsten CMP through the use of citric acid

机译：通过使用柠檬酸在钨CMP期间抑制氧化铝颗粒沉积在SiO 2表面上的影响
- 作者：L. Zhang;S. Raghavan;S. Meikle;G. Hudson;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
18.The how's and why's of characterizing particle size distributions in CMP slurries

机译：如何以及为什么在CMP浆果中表征粒度分布
- 作者：Linda Anthony;John Miner;Michael Baker;Warren lai;John Sowell;Alvaro Maury;Yaw Obeng;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
19.A cautious approach to the removal of Ta in the CMP polishing of Cu/Ta structures

机译：在Cu / Ta结构的CMP抛光中去除Ta的谨慎方法
- 作者：Vlasta Brusic;Rod Kistler;Shumin Wang;Joe Hawkins;Colin Schmidt;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
20.A high oxide: nitride selectivity CMP slurry for shallow trench isolation

机译：高氧化物：氮化物选择性CMP浆料用于浅沟槽隔离
- 作者：Olivier Laparra;Milind Weling;Sharath Hosali;Ray Lavoie;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
21.Evaluation of commercialized slurries and pads for polymer CMP (chemical mechanical polishing)

机译：评估聚合物CMP商业化浆料和垫（化学机械抛光）
- 作者：Fan Zhang;Ronald W. Wake;Lee Cook;Ahmed A. Busnaina;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
22.Electrochemical characterization of copper in ammonia-containing slurries for chemical mechanical planarization of interconnects

机译：含氨型浆料中铜的电化学表征互连化学机械平面化
- 作者：Carlyn Sainio;David J. Duquette;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
23.Development of a Copper CMP Process for Multilevel, Dual Inlaid Metallization in Semiconductor Devices

机译：多级，二元镶嵌金属化铜CMP工艺的开发
- 作者：Susan Rabke Selinidis;David K. Watts;Jaime Saravia;Jason Gomez;Chelsea Dang;Rabiul Islam;Jeff Klein;Janos Farkas;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年
24.Optimization of CMP processes for sti devices using novel metrology tools

机译：使用新型计量工具优化STI设备的CMP工艺
- 作者：David A. Hansen;C. Wu;H.B. Lu;M. Oyumi;V. Velidandla;Electrochemical Society Inc. Electronics and Dielectric Science and Technology Divisions
- 会议名称：《International symposium on chemical mechanical planarization(CMP) in integrated circuit(IC) device manufacturing》 | 1998年