CMP Applications for Sub-0.25#mu#m Process Technologies

摘要

This paper shows how CMP is a key enabler for sub-0.25#mu#m processes -CMP can be effectively used in process architectures to form shallow trench isolation, metalliz gates, form Cu-based interconnects and low "k" dielectrics. We describe the CMP challenges for these various process applications, review their current status and future trends, and suggest some novel techniques to improve their implementation.