Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED

机译：不同潜水剂对各向同性导电粘合剂性能及其在LED中的应用的影响及其应用

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The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.

机译：研究了三种潜在固化剂（甲基己酰基邻苯甲酸酐，双氰胺和酚醛树脂）对各向同性导电粘合剂性能的影响。测试了ECA的热稳定性，搭接剪切强度，体积电阻率，还评估了其在LED中的应用的赖扣性。有人发现，与Mehhpa一样努力的ECA显示出最佳的组合性能。

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《International Symposium on Advanced Packaging Materials》|2011年||共4页
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作者
Wang Ling; Wang Hongqin; Wan Chao; Wang Pengcheng; Li Mingyu; Du Bin; Deng Meiling; He Lijiao;
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中图分类 TN405.94-53;
关键词
LED application; curing agent; isotropy conductive adhesives; reliabillity;

机译：LED应用;固化剂;各向同性导电粘合剂;可靠性;

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专利

1. Syntheses of conductive adhesives based on epoxy resin and polyanilines by using N-tert-butyl-5-methylisoxazolium perchlorate as a thermally latent curing reagent [J] . Hino T, Taniguchi S, Kuramoto N Journal of Polymer Science, Part A. Polymer Chemistry . 2006,第2期

机译：N-叔丁基-5-甲基异恶唑鎓高氯酸盐作为热潜伏固化剂合成基于环氧树脂和聚苯胺的导电胶
2. Syntheses of conductive adhesives based on epoxy resin and polyanilines by using N-tert-butyl-5-methylisoxazolium perchlorate as a thermally latent curing reagent [J] . Hino T, Taniguchi S, Kuramoto N Journal of Polymer Science, Part A. Polymer Chemistry . 2006,第2期

机译：N-叔丁基-5-甲基异恶唑鎓高氯酸盐作为热潜伏固化剂合成基于环氧树脂和聚苯胺的导电胶
3. Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives [J] . Li-Ngee Ho, Hiroshi Nishikawa Journal of materials science . 2013,第6期

机译：后固化和偶联剂对聚氨酯基填充铜的导电胶的影响
4. Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED [C] . Wang Ling, Wang Hongqin, Wan Chao, 2011 International Symposium on Advanced Packaging Materials . 2011

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5. Novel conductive adhesives for electronic packaging applications: A way towards economical, highly conductive, low temperature and flexible interconnects [D] . Zhang, Rongwei 2011

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8. Low toxicity aromatic diamine curing agents for adhesives [R] . Dorsey, G. F. 1993

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Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED

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