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Simulation of Forces Acting on Tiny Chips During Fluidic Self-Assembly

机译:流体自组装过程中微小芯片作用的力模拟

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Fluidic self-assembly processes have been recently demonstrated to be a feasible method of assembling tiny chips in a cost-effective manner. In order to successfully implement the fluidic self-assembly process, it is important to quantify the magnitudes of the restoring capillary force and torque between the chip and the binding site and to determine the fluid dynamic forces acting on the chip as fluid flows over the chip. This paper presents results of numerical simulations of these restoring capillary forces and torques, and discusses the effect of various parameters on them, such as lubricant volume, component orientation and contact angle. The results show that the restoring forces in both lift and shift directions decrease significantly with the volume of lubricant. Analysis of the sensitivity of the restoring torque to the contact angle between the lubricant and the self-assembled monolayer (SAM) in water is also carried out. It is observed that, at smaller contact angles, the maximum torque is insensitive to the contact angle between 0 to 40°. It thus suggests that a lubricant with a contact angle less than 40 degrees can be used without loss of effectiveness. The equilibrium of the chip under the action of flow-induced and capillary forces has also been analysed.
机译:最近已经证明流体自组装工艺是以经济有效的方式组装微小芯片的可行方法。为了成功地实施流体自组装工艺,重要的是量化芯片和结合位点之间的恢复毛细力和扭矩的大小,并且在芯片上流动时,确定作用在芯片上的流体动力力。本文介绍了这些恢复毛细管力和扭矩的数值模拟的结果,并讨论了各种参数对它们的影响,例如润滑剂体积,组分取向和接触角。结果表明,润滑剂的体积,升力和移位方向上的恢复力显着降低。还进行了对润滑剂和自组装单层(SAM)之间的恢复扭矩对水中接触角的敏感性的分析。观察到,在较小的接触角处,最大扭矩对0至40°之间的接触角不敏感。因此,它表明可以使用具有小于40度小于40度的接触角的润滑剂而不会损失有效性。还分析了在流动诱导和毛细力作用下芯片的平衡。

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