Thermal characterization of a 3-dimensional memory module

摘要

SAMSUNG Electronics Co. has developed a 3-D memory module technique using a conventional assembly process for plastic package to get improved electrical performance, greater packaging density, and lower system weight and volume. This paper describes the thermal measurement and modeling result performed to determine the maximum junction temperature variation with the number of stacked packages and temperature distributions within 3-D modules. The effect of packaging materials on 3-D module's thermal performance is also presented.