Thermal-emitting Memory Module, Thermal-emitting Module Socket Electrically Connecting The Thermal-emitting Memory Module, Computer System Comprising The Thermal-emitting Memory Module And The Thermal-emitting Memory Module, And Method Of Using The Computer System Comprising The Same

摘要

It provides a heat-dissipating module, a memory, a method of using the heat dissipating module and a memory module socket, the electrical heat dissipation, the heat dissipating module and a computer memory system, and the computer system having a heat dissipating module sockets to be connected to. To this end, the heat dissipating module and a memory module socket, the heat dissipation is provided a way to cool the heat generated from them during the operation of the computer system in a short time. For this purpose, a heat-dissipating module socket mounted in the computer system can be prepared. The heat dissipating module socket may have a socket body provided with fluid flow gate for exposing the connecting portion, the connecting portion surrounding the fluid reservoir and the fluid reservoir. The heat dissipation of memory modules connected to the heat dissipating module socket and electrically may be prepared. The heat dissipating memory module can have a module substrate, semiconductor element, and a heat dissipating portion. ; A module substrate, semiconductor device, a memory module, the socket body, the storage