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Single Ended Static Random Access Memory for Low-Vdd, High-Speed Embedded Systems

机译:低VDD,高速嵌入式系统的单端静态随机存取存储器

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Single-ended static random access memory (SESRAM) is well known for their tremendous potential of low active power and leakage dissipations. In this paper, we present a novel six-transistor (6T) SE-SRAM bitcell for low-Vdd and high speed embedded applications with significant improvement in their power, performance and stability under process variations. The proposed design has a strong 2.65× worst case read static noise margin (SNM) compared to a standard 6T SRAM. A strong write-ability of logic 'one' is achieved, which is problematic in SE-SRAM cells even at lower voltage. The proposed bitcell design is mainly targeted for word-organized SRAMs. A 16 × 16 × 32bit SRAM with proposed and standard 6T bitcells is simulated'(including parasitics) for 65nm CMOS technology to evaluate and compare the different performance parameters, such as, read SNM, write-ability, access delay and power. The dynamic and leakage power dissipation in the proposed 6T design is reduced by28% and 21%, respectively, as compared to standard 6T design.
机译:单端静态随机存取存储器(SESRAM)众所周知,众所周知,其巨大的有源电力和泄漏耗散。在本文中,我们提出了一种用于低VDD和高速嵌入式应用的新型六晶体管(6T)SE-SRAM位,其功率,性能和稳定性的显着提高。与标准6T SRAM相比,所提出的设计具有强大的2.65倍最差情况读取静态噪声裕度(SNM)。实现了逻辑'一个'的强大写入能力,即使在较低电压下也存在于SE-SRAM电池中存在问题。所提出的位线设计主要针对字组织的SRAM。具有提议的16×16×32位SRAM,具有建议的和标准6T位电池的SRAM为65nm CMOS技术,以评估和比较不同的性能参数,例如读取SNM,写入能力,访问延迟和电源。与标准6T设计相比,所提出的6T设计中的动态和漏电功耗分别降低了28%和21%。

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