首页> 外文学位 >Pattern identification of multiple cell upsets in static random access memories: A correlation of experimental test results to single event upset mechanisms.
【24h】

Pattern identification of multiple cell upsets in static random access memories: A correlation of experimental test results to single event upset mechanisms.

机译:静态随机存取存储器中多个细胞不适的模式识别:实验测试结果与单事件不适机制的相关性。

获取原文
获取原文并翻译 | 示例

摘要

Multiple cell upsets (MCUs) were first observed in static random access memory (SRAM) in the 1980s. As microelectronics technology scaled, the number of cells affected by an ion strike increased. In order to assess test data, the MCU patterns first need to be associated to mechanisms. This research provides that link by re-evaluating the underlying soft error mechanisms for the SRAM cell and array. Modeling, simulation, and experimental approaches were developed to determine the MCU characteristics and to associate them with mechanisms.;The study of SRAM single event upset led to the identification of the well-collapse source-injection (WCSI) mechanism. This mechanism was encountered when charge collection in the well/substrate p-n junction exceeded the amount that can be supplied by the well and/or substrate contacts. When this occurs, the additional photocurrent is supplied by source/body p-n junction diodes in forward-bias. The forward-bias condition injects minority carriers near the MOSFET drains to induce drain current. The WCSI is shown to have a large range of effect, collapsing an entire well and forward-biasing all of the source/body p-n junctions.;Technology computer aided design (TCAD) modeling of the WCSI mechanism showed that SRAM cell upset was dependent upon two factors: (1) the forward-bias current and (2) the relative resistances between the source/body p-n junctions and the well-collapse region. These factors enabled the MOSFETs to be replaced with source diodes having an equivalent resistive path. That breakthrough allowed many more devices to be simulated in one TCAD model and enabled the MCU properties of the WCSI mechanism to be understood.;A 65-nm SRAM provided experimental data sets containing MCUs; these were analyzed for the WCSI mechanism. The first data set verified TCAD simulations for ion strikes at high incident angles as well as provided many examples of MCU patterns. The second set of data showed that the observed SEU cross section depended upon the SRAM power supply voltage. Overall, the WCSI mechanism increased the number of upsets found in the experimental data.
机译:在1980年代首次在静态随机存取存储器(SRAM)中观察到了多个单元异常(MCU)。随着微电子技术的发展,受离子撞击影响的电池数量增加了。为了评估测试数据,首先需要将MCU模式与机制关联。这项研究通过重新评估SRAM单元和阵列的底层软错误机制来提供该链接。开发了建模,仿真和实验方法来确定MCU特性并将其与机制相关联。;对SRAM单事件翻转的研究导致了对井喷源注入(WCSI)机制的识别。当阱/衬底p-n结中的电荷收集超过阱和/或衬底触点可提供的数量时,会遇到此机制。发生这种情况时,源/体p-n结二极管以正向偏置提供额外的光电流。正向偏置条件会在MOSFET漏极附近注入少数载流子,以感应出漏极电流。已显示出WCSI具有广泛的作用范围,使整个阱塌陷并使所有的源/体pn结正向偏置。两个因素:(1)正向偏置电流;(2)源/体pn结与阱塌陷区之间的相对电阻。这些因素使MOSFET可以被具有等效电阻路径的源极二极管取代。这一突破使得在一个TCAD模型中可以仿真更多的设备,并使WCSI机制的MCU特性得以理解。65纳米SRAM提供了包含MCU的实验数据集。针对WCSI机制进行了分析。第一个数据集验证了高入射角离子撞击的TCAD模拟,并提供了许多MCU模式示例。第二组数据显示,观察到的SEU横截面取决于SRAM电源电压。总体而言,WCSI机制增加了实验数据中发现的不安现象。

著录项

  • 作者

    Black, Jeffrey D.;

  • 作者单位

    Vanderbilt University.;

  • 授予单位 Vanderbilt University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 178 p.
  • 总页数 178
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

  • 入库时间 2022-08-17 11:38:38

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号