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TEM study of sputter deposited titanium films on silicon and the silicidation reaction during rapid thermal processing

机译:快速热处理硅溅射钛膜的TEM研究及硅化反应

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The microstructure of sputter deposited Ti films on Si is studied. The Ti/Si interface and the texture of the Ti films will be addressed. The C54 TiSi_2 layers, formed from C49 after selective etching and subsequent rapid thermal processing, are investigated. The annealing in a nitrogen ambient results in the formation of TiN precipitates in the surface region of the C54 layers.
机译:研究了Si上溅射沉积的Ti薄膜的微观结构。将解决TI / SI接口和TI薄膜的纹理。研究了由C49形成的C54 TISI_2层,并在选择性蚀刻和随后的快速热处理后形成。氮环境中的退火导致在C54层的表面区域中形成锡沉淀物。

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